VertiClean - Advanced Photomask Processor
The VertiClean Advanced Photomask Processor is a modular wet bench for single substrate processing, i.e. photomasks of sizes 6" x 6" or larger, guaranteeing ultimate process results.
The modular system architecture with immersion tanks, made of quartz or PVDF, and a flexible process flow with random access to the individual process tanks can be customized for all wet processes.
Applications
The modular system architecture with immersion tanks, made of quartz or PVDF, and a flexible process flow with random access to the individual process tanks can be customized for all wet processes.
Applications
- Quartz etching with HF
- SPM and SOM cleaning
- SC1 and SC2 cleaning
- Megasonic cleaning
- IPA/N2 drying
- VUV/ozone cleaning
- Custom applications
Specifications
|
Immersion Tanks
|
Customized, made of quartz / PVDF f. single substrate processing |
| Overflow Tanks
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For continuous process media flow & subsequent DI-water rinsing |
| Diffuser Pipes
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For homogeneous distrib. of process media across the substrate |
| Optimized process
|
SPM, SOM, SC1, SC2, HF |
| Megasonic
|
High efficient megasonic transducer with non-directive irradiation |
| Handling
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State-of-the-art XLSI chemicals handling, ultra-pure components. |
| Hoses
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All hoses and fittings made of PFA (Flair or Pillar) |
| Media Preparation
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In-situ mixture of chemicals |
| Temp. Control
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Exact temperature control of process media |
| Progr. Rates
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Progr. concentration, flow rates and temperature of process media |
| Process Flow
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Flexible, with random access to the individual process stations |
| Expandability
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Integration of future cleaning techniques possible |
| Chemical supply
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Chemical supply and distribution system with ozone generation |
| Waste collection
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Waste collection system with separation of various chemicals |
| Tool Controller
|
Programmable |
Components
The VertiClean Quartz Etcher features a process tank made of PVDF with a unique pressurized diffuser plate overflow system resulting in uniform etch media flow onto the substrate surface, guaranteeing superior process results. All
standard cleaning and etching processes as well as new to be
developed cleaning techniques are possible





