CorWet - Single Wafer Cleaner
The CorWet Single Wafer Cleaners are stand-alone tools with horizontal
wafer processing for 2" up to 300mm wafers featuring simultaneous
treatment of top and bottom side of wafers.
The CorWet state-of-the-art wafer cleaners for designed for future requirements of advanced sub-micron technology in IC fabrication. The systems can operate with all different techniques used in wafer cleaning, such as
All the different processes can be performed in one process chamber featuring separation of the cleaning and drying process, thus preventing cross contamination.
A patented spin chuck assembly with integrated wafer rotation system allows simultaneous front- and backside processing of the wafers with all different cleaning techniques to be used simultaneously or in sequence.
Two independent robots or one robot with dual end-effector are available for cassette-to-cassette operation with separate sender and receiver stations, i.e. wet or dry sender station with standard open cassettes, SMIF pots and FOUP. The robots also can transfer the wafers between adjacent processors for other applications.
A high degree in process flexibility together with computer supported parameter optimization guarantee continuously excellent process results with highest yield. Together with a small footprint and low media consumption, as well as with an outstanding reliability, the Corwet cleaners ensure lowest cost of ownership.
The CorWet state-of-the-art wafer cleaners for designed for future requirements of advanced sub-micron technology in IC fabrication. The systems can operate with all different techniques used in wafer cleaning, such as
- Double-sided brush cleaning
- High pressure cleaning
- Megasonic cleaning
- Chemical supported cleaning
- Patented Jet-Steam cleaning
- Spin drying w. IPA/N2 support
All the different processes can be performed in one process chamber featuring separation of the cleaning and drying process, thus preventing cross contamination.
A patented spin chuck assembly with integrated wafer rotation system allows simultaneous front- and backside processing of the wafers with all different cleaning techniques to be used simultaneously or in sequence.
Two independent robots or one robot with dual end-effector are available for cassette-to-cassette operation with separate sender and receiver stations, i.e. wet or dry sender station with standard open cassettes, SMIF pots and FOUP. The robots also can transfer the wafers between adjacent processors for other applications.
A high degree in process flexibility together with computer supported parameter optimization guarantee continuously excellent process results with highest yield. Together with a small footprint and low media consumption, as well as with an outstanding reliability, the Corwet cleaners ensure lowest cost of ownership.
Specifications
| CorWet 300 |
For
200mm & 300mm wafers |
| CorWet 200 |
For
100mm, 150mm & 200mm wafers |
| CorWet 100 |
For
2", 3" & 100mm wafers |
Components
The process chamber has been specially designed for cleaning the wafers with all the available techniques.
A patented chuck system with integrated wafer rotation allows simultaneous cleaning of front- and backside of wafers with different process parameters and various cleaning methods.
Double-sided brush cleaning with additive chemicals has been established as the standard process for post CMP cleaning or post polish cleaning. Therefore, a new brush cleaning module has been developed.
High pressure cleaning is extremely effective in particle removal around small features, including trench cleaning. DI- water or aqueous chemistry can be used for non-contact cleaning or solvent spray for stripping.
A new megasonic bar transducer has been developed for non-contact single wafer cleaning technique used for post-CMP, post-polish, and other cleaning applications. This high frequency 1 MHz megasonic transducer guarantees an efficient cleaning of most sensitive surfaces from particle.
Jet-Steam cleaning is a patented non-contact single wafer cleaning technique for post-CMP, post-polish etc.