CorWet - Single Wafer Cleaner
Corwet Single Wafer Cleaner -
horizontal wafer processing for 2" up to 300mm wafers featuring simultaneous cleaning of wafer front and back side
Tool Concept
The Corwet is a state-of-the-art wafer cleaner designed for highest flexibility in operation at low cost of ownership. It combines small footprint with all available techniques used in wafer cleaning, such as
All different processes can be performed in one process chamber featuring separation of the cleaning and drying process, thus preventing cross contamination.
A patented spin chuck for assembly with integrated wafer rotation system allows simultaneous front- and backside processing of the wafers with different cleaning techniques to be used simultaneously or in sequence.
The Corwet system features a handling robot with dual end-effector for fully-automatic cassette-to-cassette operation with separate sender and receiver stations, i.e. wet or dry sender station with standard open cassettes. The robot may also be used to transfer the wafers between adjacent processors for other applications.
A high degree in process flexibility combined with a wide range of recipe parameter guarantee continuously excellent process results with highest yield. Together with a small footprint and low media consumption, as well as with an outstanding reliability, the Corwet cleaners ensure lowest cost of ownership.
horizontal wafer processing for 2" up to 300mm wafers featuring simultaneous cleaning of wafer front and back side
Tool Concept
The Corwet is a state-of-the-art wafer cleaner designed for highest flexibility in operation at low cost of ownership. It combines small footprint with all available techniques used in wafer cleaning, such as
|
|
|
|
|
|
All different processes can be performed in one process chamber featuring separation of the cleaning and drying process, thus preventing cross contamination.
A patented spin chuck for assembly with integrated wafer rotation system allows simultaneous front- and backside processing of the wafers with different cleaning techniques to be used simultaneously or in sequence.
The Corwet system features a handling robot with dual end-effector for fully-automatic cassette-to-cassette operation with separate sender and receiver stations, i.e. wet or dry sender station with standard open cassettes. The robot may also be used to transfer the wafers between adjacent processors for other applications.
A high degree in process flexibility combined with a wide range of recipe parameter guarantee continuously excellent process results with highest yield. Together with a small footprint and low media consumption, as well as with an outstanding reliability, the Corwet cleaners ensure lowest cost of ownership.
Specifications
| CorWet 300 |
For
200mm & 300mm wafers |
| CorWet 200 |
For
100mm, 150mm & 200mm wafers |
| CorWet 100 |
For
2", 3" & 100mm wafers |
Main characteristics
- Automatic wafer handling
- Manual wafer handling
- Integration into cluster tools
- Substrate sizes from 2” up to 300mm
- Silicon, Tungsten, Sapphire, GaAs and various other materials
- Compatible to CE, SEMI E10-92, Bosch N51 standards
Components
Mullti-position process chamber designed for single-chamber processing with all cleaning technologies available.
Patented dual-rotation chuck system with integrated wafer rotation allows simultaneous cleaning of front- and backside of wafers with different process parameters and various cleaning methods.
Double-sided brush cleaning with additive chemicals has been established as the standard process for post CMP cleaning and other cleaning steps. CorWet features simultaneous front- and backside brush cleaning.
High pressure cleaning is extremely effective in particle removal around small features, including trench cleaning. DI- water or aqueous chemistry can be used for non-contact cleaning.
Megasonic nozzle and transducer systems for non-contact single wafer cleaning for post-CMP, post-polish, and other cleaning applications. High-frequency megasonic cleaning with frequencies up to 3 MHz guarantee efficient cleaning of most sensitive surfaces from particle.